OPUS3 SE
OPUS3 SE is specialized in 6 & 8 inch wafer handling and it is optimized to compact foot print.
It is compact, with high accuracy for consistent contact/probing and fast index time for higher throughput.
Key features Overview
- Specialized in 6 & 8 inch wafer
- Space efficient foot print
- Reliable temperature control
- Stiff and strong Z structure
- Map shift prevention
- Real-time recipe validation
- Intelligent pin alignment algorithm
- Smart probing route algorithm
Specification Overview
| Name | OPUS3 SE |
| Wafer Size | 6 & 8 inch |
| X, Y Probing Area | X : ±115mm |
| Y : ±115mm | |
| Max Probing Force | 230kgf |
| XY Accuracy | X : ±1.5㎛ |
| Y : ±1.5㎛ | |
| Tri-Temp | COLD: -40℃ / -55℃ |
| HOT: 150℃ / 200℃ | |
| AMBIENT CONTROL (25℃) |